MRS technology suppresses any reflections that can distort the data, especially on shiny components, enabling precise 3D representation while the architecturally superior sensor design captures and transmits data simultaneously and in parallel. The result is high speed and accuracy. The system generates high precision images of entire PCB in full color with 3D image fusing algorithms and delivers accurate pin height/package coplanarity measurement. It is easy-to-use with simple intuitive interface and touch control.
productronica innovation award: Halle A2, Stand 459