This combination is made possible by the machine‘s ability to self-calibrate on the fly, allowing accuracy to be maintained, even as the system delivers on high speed requirements. The solution is suitable for all SMT applications, as well as advanced packaging processes. In the SMT arena, it is ideal for high-volume manufacturers producing highly-dense assemblies with ultra-miniaturized components, e.g. for mobile phones, wearables, other handhelds and medical devices. For the advanced packaging sector, the machine enables fast, precise, low force and touchless placement of bare die and passive components from tape and reel, enabling assembly of complex and fragile SiP modules and other die placement applications. The system delivers accuracy with placement gaps as tight as 50 µm and bump size capability of 50 µm. The platform is housed in a compact footprint, with each module measuring 1 m x 2.3 m. The three different placement modes (collect & place, pick & place, mixed mode) of the Siplace Multi Star placement head accommodate a wide component range.
Productronica 2017: hall A3, booth 377