The technology uses high-precision semiconductor lasers, which rotate around the wire and cut the insulation to the programmed depth and width. Two different wavelengths enables a wide range of insulation materials to be processed. The rotationally symmetric stripping of the insulation and the automatic diameter detection capability make for high-quality cuts, with no risk of nicking or scratching the conductor or metallic shield. Even non-circular shielded twisted cables with very thin insulation materials can be processed without damaging the shield or inner cable insulation. Contrary to mechanical or thermal solutions, it is no longer necessary to inspect the stripping results or the tool. The stripping cycle typically takes 1-3 s. A demo unit will be presented in combination with the Easy Wiring interactive wiring board.

Productronica 2017: hall A5, booth 211

(mou)

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