Key advantages include >180 ˚C melting temperature, drop shock performance, comparable to SAC, mechanical shear strength up to 165 ˚C and good thermal and electrical conductivity. Drop shock testing has shown that the system shows about two orders of magnitude higher drop shock resistance than comparative low-temperature alternatives. The combination with Indium5.7LT-1 provides exceptional process performance including printing, wetting, voiding, and solder beading for a wide variety of SMT applications . Reducing the reflow process temperature means that energy consumption is less, cheaper substrates and components can be used that employ lower temperature materials to manufacture. As well as, the elimination of the wave soldering process, prevention of multilayer board warpage and possibility for step soldering, particularly in RF shield attachment and rework applications.

Productronica 2019: Halle A4, Stand 214