The possibilities include conductor widths and spacings down to 25 µm with copper thicknesses of 20 ±5 µm on all conductive layers, laser-via diameters of 35 µm, annular rings with a diameter of 30 µm for the inner layers and 20 µm for the outer layers, copper-filled blind vias with the option of via stacking, and vias-in-pads. Furthermore, the use of advanced materials allows the production of ultra-thin circuits, including, the manufacture of 4-layer flex circuits with a total thickness of less than 120 µm.

Productronica 2017: hall B3, booth 560