The system uses the laser as a noncontact precision tool for micromachining glass. In the cutting Mode, precise cuts and lines in thin glass (<500 µm) can be realized with a modification speed up to 100 mm/s – without any microcracks or stresses. This opens a wide range of options for the microsystems technology. Lide is a two-step process consisting of high-speed laser processing and wet chemical treatment. The laser in the system modifies the glass so that the irradiated areas can be removed in the subsequent etching step. Etching in a second process step ensures clean, stress-free material removal. With controlled overlapping of laser pulses, even precise cuts in glass are easy – directly from digital data and without masking procedures or the use of special glass. At full speed, the machine can achieve a hole position tolerance of ±5 µm across an area of 510 x 510 mm2.
Productronica 2017: hall B2, booth 303