productronica | Weltleitmesse Entwicklung Fertigung Elektronik



And the winner is…

The winners of the third productronica innovation award were announced on the first day of productronica 2019: An independent panel of jury selected the most innovative products and solutions from almost 60 submissions.

For Falk Senger, Managing Director of Messe München, the award is an important stimulus for the industry: “Electronics production stands at the beginning of the value chain for tomorrow‘s electronics—here, new technologies are developed and significantly promoted. The numerous submissions show how much innovative power there is in this industry.” The productronica innovation award is the first independent award in the electronics manufacturing industry and is awarded in close cooperation with the trade journal Productronic (Hüthig Verlag).

The winners of the 3rd productronica innovation award 2019 were:


„Cables, Coils & Hybrids“ cluster winner:

Zoller + Fröhlich for it‘s AM 04 Duomatic: Auf Knopfdruck Querschnitt wechseln

Christoph Fröhlich, CEO, Zoller + Fröhlich: “As one of the first ever exhibitors at productronica, our father, Hans Fröhlich, recognized the importance of this trade fair early on. As the second generation at the helm of the company, my sister and I are extremely honored to accept the Innovation Award as part of this event. We are particularly proud of the fact that by combining the traditional values of a family business with high-tech production in Wangen im Allgäu we have been able to achieve a level of innovative prowess which puts us in a market-leading position. We continuously strive to systematically increase added value for our customers, now and in the future. The AM 04 Duomatic is yet another example of us doing so, by replacing two machines with one. We would like to take this opportunity to thank the panel of judges for this award as well as our employees for ensuring our continued success.”


„Future Markets“ cluster winner:

F&S BONDTEC Semiconductor for the BAMFIT: Bond-Tester mit automatisiertem Schnelltest

Siegfried Seidl, MAS, Managing Partner, F&S Bontec: “We are absolutely thrilled to receive the productronica Innovation Award 2019. It is recognition of our extremely successful collaboration with TU Wien (Vienna University of Technology) on reliability diagnostics for power electronics: our revolutionary Bamfit Tester is almost like a ‘time machine’ as it reduces the classic service life tests for heavy wire bonds from months down to minutes and thus significantly expands the range of diagnostic possibilities. This is a huge advantage, especially in the e-mobility era in which power electronics are becoming increasingly important.”


“Inspection & Quality” cluster winner:

Vision Engineering for the DRV (Deep Reality Viewer): Digitale 3D-Bilder auf Hohlspiegel

Joachim Glaab, General Manager, Vision Engineering Central Europe: “Effectively, as a Munich-based office of a long-established British company we have been exhibiting at productronica for 30 years and of course are still committed to taking part in and showcasing our company at all major national and international events. The award is confirmation that we have struck the right chord with the industry by developing an innovative future technology which is already capable of providing added value in terms of quality assurance, manufacturing and development. All of our employees are thrilled about the award. It will also encourage us in the future to continue to provide users with the best possible and most ergonomically convenient way of digitally or optically inspecting and viewing images.”


„PCB & EMS“ cluster winner:

Limata for it‘s LUVIR-Technolgie: Solder System combines UV and IR Laser

Matthias Nagel, Co-founder, Limata: “It took four years to develop LUVIR: a really outstanding team achievement! Numerous major hurdles were overcome one by one and with a real sense of teamwork and motivation, from the concept stage right through to technical execution and final integration in the production lines. Outstanding levels of efficiency have been seen and achieved in these production lines all around the world for almost a year now, and hearing about how thrilled our customers are is a wonderful reward for all the hard work. And winning the Innovation Award for LUVIR at the world’s largest electronics trade fair is truly the icing on the cake.”


“Semiconductor” cluster winner:

ASM AMICRA Microtechnologies for it‘s CoS Die-Bonder: Die-Bonder combines two independent bonders

Johann Weinhändler, Managing Director, ASM Amicra Microtechnologies: “The development of our new chip-on-submount die bonder is based heavily on the development-related synergies available to us on account of our successful integration within the ASMPT Group. The result is a CoS die bonder which achieves optimum bonding precision on account of the Amicra dynamic alignment concept and, thanks to the ASMPT assemblies, also increases productivity. We are proud to receive the Messe München productronica award which will also spur the entire ASMPT team on to support the rapid developments in the advanced packaging sector with innovative, powerful technologies and products.”


“SMT” cluster winner: ,

Seho Systems for the Select Line-C: Selective Soldering Process for Next-Generation Products
Markus Walter, Managing Partner, Seho Systems: “Seho is very proud to receive the productronica Innovation Award 2019. Thanks to continuous research, in-depth discussions with our customers and partners from industry and science, and not least our highly motivated team, Seho is able to turn trends in electronics production into series-ready processes early on. Our goal is to continuously create added value for our customers by constantly further developing processes and our systems, optimizing them to meet future requirements and implementing innovative ideas. We have managed to do that brilliantly with the new SelectLine-C.



The submissions had been assessed by a top-class jury consisting of:

  • Professor Klaus-Dieter Lang, Fraunhofer IZM
  • Dr.-Ing. Andrej Novikov, University of Rostock
  • Dr. Heinz Wohlrabe, TU Dresden
  • Professor Lothar Pfitzner, Fraunhofer IISB
  • Thilo Brückner, VDMA
  • Christoph Stoppok, ZVEI

With productronica 2021, we will continue our success story. Who will hold the 2021 trophy in their hands?