80 submissions for the 3rd productronica innovation award 2019!
The electronics manufacturing industry is playing its trump cards
80 exhibitors of productronica 2019, the world‘s leading trade fair for electronics development and production, responded to the call to send their innovations into the race for the first independent award in electronics manufacturing—the productronica innovation award. We have received applications from every cluster from all over the world. As was to be expected, the share of the SMT cluster was the largest, but there were also several applicants for the PCB & EMS clusters, the Future Markets cluster, the Semiconductor cluster and the Cables, Coils & Hybrids cluster. The “Inspection & Quality” cluster launched in 2017 was also well received, so that the “Inspection & Quality” category will once again see the presentation of an award this year.
The submissions show where the journey in electronics manufacturing will take us in the future. Reliability and efficiency are of primary importance for these developments. In addition to established leaders in electronics manufacturing, smaller companies are also eager to earn the award with their product innovations—which is highly commendable.
And here they are, all the innovations submitted for the 3rd productronica innovation award 2019:
|F&S Bondtec Semiconductor||BAMFIT: Bond-Tester mit automatisiertem Schnelltest|
|Fraunhofer-Institut für Keramische Technologien und Systeme IKTS||Sonektro: Ceramic Module for Removal of Medicine Residues|
|Hesse Mechatronic||Smart Welding Machines: Smart Ultrasonic Welding and Bonding|
|Komax||Connect: Cloud Service with flexible License|
|Konrad Technologies||Advanced Temperature Test System (KT-ATTS): Temperature Test System adapts to all Specimen|
|Sekas||SeReMo (Se-cure Re-mote Mo-nitoring): Anonymisation and end-to-end encryption|
|Swissmic||Agilink Smart Material Shelf: Traceability for the factory floor|
|TSK Prüfsysteme||TSK Connect: Technology uses Smartphone as MMI|
|Wezag Werkzeugfabrik||CK 130 D: Crimpwerkzeug mit digitaler Intelligenz|
|Zlín Robotics||Universal Mobile Stand (UMS) or Cobots: Quickly relocate Cobots|
|Gebrüder Schmid||InfinityLine C+: Single panel processing|
|Indium Corporation||Durafuse LT: Alloy System for low-temperature Applications|
|Kyzen||Aquanox A4727: Assembly Cleaner reduces drying time|
|Limata||LUVIR-Technolgie: Solder System combines UV and IR Laser|
|Thermaltronics USA||TMT-R9900S: Inline Soldering Robot ready for Industry 4.0|
|ASM Amicra Microtechnologies||CoS Die-Bonder: Die-Bonder combines two independent bonders|
|Foba Laser Marking + Engraving (Alltec)||Titus: Laser marking system for line integration|
|Komax||Cloud MES: MES Cloud Licences for SMEs|
|Komax||On.Line Training: Online Training gets new Employees up to Speed|
|Komax||Sigma 688 ST: Fully automated Wire-end Process|
|Komax||Smart Stock: Vending Machine reduces Stock and Costs|
|Laser Wire Solutions||Odyssey-4: Laser Wire Stripper strips tiny Wires|
|Panduit||Flushmount Table Top Fixture for PAT 4.0 Cable Tie Installation System|
|Stone Shield||RoSI – Robotic Seal Inserter with different Tools|
|Zoller + Fröhlich||AM 04 Duomatic: Auf Knopfdruck Querschnitt wechseln|
Inspection & Quality Cluster
The fact that Messe München, in close cooperation with the trade journal Productronic published by Hüthig Verlag, knew how to read the signs of the times becomes clear by the high number of entries submitted by exhibitors eager to win the trophy.
Product innovations and manufacturing processes must meet very clear criteria in order to have a chance of winning the first productronica innovation award: They must be technically innovative or economical, show a novel design or be easy to integrate into systems. The productronica innovation award is the first independent award in the electronics manufacturing industry and will be presented by productronica on the first day of the trade fair (November 12, 2019). All exhibitors of productronica 2019 and SEMICON Europa 2019 will have the opportunity to present themselves in an impressive way at a forum that is unique in the world.