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80 submissions for the 3rd productronica innovation award 2019!

The electronics manufacturing industry is playing its trump cards

80 exhibitors of productronica 2019, the world‘s leading trade fair for electronics development and production, responded to the call to send their innovations into the race for the first independent award in electronics manufacturing—the productronica innovation award. We have received applications from every cluster from all over the world. As was to be expected, the share of the SMT cluster was the largest, but there were also several applicants for the PCB & EMS clusters, the Future Markets cluster, the Semiconductor cluster and the Cables, Coils & Hybrids cluster. The “Inspection & Quality” cluster launched in 2017 was also well received, so that the “Inspection & Quality” category will once again see the presentation of an award this year.

The submissions show where the journey in electronics manufacturing will take us in the future. Reliability and efficiency are of primary importance for these developments. In addition to established leaders in electronics manufacturing, smaller companies are also eager to earn the award with their product innovations—which is highly commendable.

And here they are, all the innovations submitted for the 3rd productronica innovation award 2019:

Future Markets Cluster
Company Product name
F&S Bondtec Semiconductor BAMFIT: Bond-Tester mit automatisiertem Schnelltest
Fraunhofer-Institut für Keramische Technologien und Systeme IKTS Sonektro: Ceramic Module for Removal of Medicine Residues
Hesse Mechatronic Smart Welding Machines: Smart Ultrasonic Welding and Bonding
Komax Connect: Cloud Service with flexible License
Konrad Technologies Advanced Temperature Test System (KT-ATTS): Temperature Test System adapts to all Specimen
Sekas SeReMo (Se-cure Re-mote Mo-nitoring): Anonymisation and end-to-end encryption
Swissmic Agilink Smart Material Shelf: Traceability for the factory floor
TSK Prüfsysteme TSK Connect: Technology uses Smartphone as MMI
Wezag Werkzeugfabrik CK 130 D: Crimpwerkzeug mit digitaler Intelligenz
Zlín Robotics Universal Mobile Stand (UMS) or Cobots: Quickly relocate Cobots
PCB & EMS Cluster
Company Product name
Gebrüder Schmid InfinityLine C+: Single panel processing
Indium Corporation Durafuse LT: Alloy System for low-temperature Applications
Kyzen Aquanox A4727: Assembly Cleaner reduces drying time
Limata LUVIR-Technolgie: Solder System combines UV and IR Laser
Thermaltronics USA TMT-R9900S: Inline Soldering Robot ready for Industry 4.0
Semiconductor Cluster
Company Product name
ASM Amicra Microtechnologies CoS Die-Bonder: Die-Bonder combines two independent bonders
Foba Laser Marking + Engraving (Alltec) Titus: Laser marking system for line integration
Cables, Coils & Hybrids Cluster
Company Product name
Komax Cloud MES: MES Cloud Licences for SMEs
Komax On.Line Training: Online Training gets new Employees up to Speed
Komax Sigma 688 ST: Fully automated Wire-end Process
Komax Smart Stock: Vending Machine reduces Stock and Costs
Laser Wire Solutions Odyssey-4: Laser Wire Stripper strips tiny Wires
Panduit Flushmount Table Top Fixture for PAT 4.0 Cable Tie Installation System
Stone Shield RoSI – Robotic Seal Inserter with different Tools
Zoller + Fröhlich AM 04 Duomatic: Auf Knopfdruck Querschnitt wechseln
SMT Cluster
Company Product name
Acculogic Flying Bridge System performs all Tests
Almit LFM-48W MR-NH: Bleifreie Lötpaste steigert Ausbeute
ASM Assembly Systems Factory Chat: App digitalizes production-related communication
Asys Automatisierungssysteme Depaneling System with intelligent Gripper
Asys Automatisierungssysteme Multiple loading/unloading of magazine slots: PCB Loader avoids sliding Boards
Asys Automatisierungssysteme Combined magazine and stack loader with autonomous loading via AIV
Asys Automatisierungssysteme Material Warehouse: Storage solution for PCB magazines
Bokar International XSO Super Oven: Convection Batch Oven in advanced R&D
Controlar TSIM: Test System automatically monitors energy consumption
CRS Prüftechnik AFC: Adapterwechsel für Inline-Prüfstationen automatisiert
Ekra Automatisierungssysteme RFID Setup Control simplifies verification process
Ersa Exos 10/26: Void reduction with convection reflow soldering system
Ersa Versafit: Press-fit Assembly with Inline System
Fuji Europe Corporation NXTR: Zero placement defects
Global Point ICS Professional Temperature Monitoring (PTM)
Hakko FN-1010 IoT-Lötstation erfasst Prozessdaten
ITW EAE Electrovert Dwell Flex 4.0: On-the-fly adjustable Wave Solder Nozzle
ITW EAE Dynamic Dual Head (DDH): Allows Simultaneous Dispensing
Nordson Asymtek Panorama S-Line for Conformal Coating uses dual-deck Design
Rehm Thermal Systems Vision Triple X: Soldering System combines forced Convection and Condensation
Seica Pilot BT: Battery Test with four independent Test Heads
Seica Rapid H4 Flex: Testing system for flexible PCBs
Schnaidt Nutzentrennen mit effizientem Lean-Konzept von Schnaidt
Seho Systems Wave Soldering with Automatic Wave Height Measurement and Nozzle Height Adjustment
Seho Systems Select Line-C: Selective Soldering Process for Next-Generation Products
Teknek UK SMT II: Low Static Board Cleaner
Unitechnologies MPS700: Bottom Side Selective Soldering Machine with Iron Head Technology
Vayo (Shanghai) Technology Pro-DFM Expert: Virtual Assembly Software
Vayo (Shanghai) Technology Vayo-AXI&AOI Accelerator V5 offers 3D virtual Assembly Software
Vayo (Shanghai) Technology Stencil Designer V3: Tool designs Screen Printer Stencil
Vieweg Dosier- und Mischtechnik Smart Box: Raupendosierung in Robotersystemen
Werner Wirth 2 Prozesse – 1 Zelle: Plasma- und Dispenstechnologie kombiniert

Inspection & Quality Cluster

Company Product name
6TL Engineering 6TL-36: Modular Test Handler for massproduction of RF based products
Digitaltest Complete Optical Repair Solution (CORS): Ferngesteuerte Fehlersuche
Electrónica, Informática, Instrumentación y Telecomunicaciones (EIIT) Robot ABB Yumi Motor Insertion: Robotic, Artificial Vision and Collaborative combined
Keinath Electronic Sparktrap EPA Gatekeeper: Grounding Tester integrates RFID Card Reader
Keysight Technologies Keysight i3070 Series 6 ICT System improves Throughput
Keysight Technologies PathWave Manufacturing Analytics: Offers Advanced Analytics as a Service
Komax Q1250 Optical Crimp Monitoring System increases Crimp Quality
Lebert Software Engineering EFA Picture Microscope: High-resolution overall Images of PCB
Lxinstruments 2-in-1 test system for functional and high voltage tests
Optical Control  (Nordson Dage) OC SCAN CCX.4: Completely automated Component Counter
Optimum Datamanagement Solutions Assistenzsystem Schlauer Klaus mit Laser
PBT Works Verinas: PCBA cleaning process verification system
Schleuniger Flexi Test 300: Testing and handling system for electromechanical components, etc.
Test Research, Inc. (TRI) TR7700 SV 3D: True 3D and real-time monitoring
TSK Prüfsysteme Push Pull Touch: User Guiding System for single Wire Insertion
ULT LRA 200.1: Absauganlage passt Saugleistung an
Viscom S3016 ultra: 3D AOI, angled and orthogonal inspection
Vision Engineering DRV (Deep Reality Viewer): Digitale 3D-Bilder auf Hohlspiegel
Weiss Umwelttechnik Kältemittel WT69 (R469A): Umweltfreundliches Kältemittel ersetzt R32
Yamaichi Electronics Deutschland Y-ETI: Mechanischer Prüfadapter bedient mehrere Testsystemkonfigurationen

The fact that Messe München, in close cooperation with the trade journal Productronic published by Hüthig Verlag, knew how to read the signs of the times becomes clear by the high number of entries submitted by exhibitors eager to win the trophy.

Product innovations and manufacturing processes must meet very clear criteria in order to have a chance of winning the first productronica innovation award: They must be technically innovative or economical, show a novel design or be easy to integrate into systems. The productronica innovation award is the first independent award in the electronics manufacturing industry and will be presented by productronica on the first day of the trade fair (November 12, 2019). All exhibitors of productronica 2019 and SEMICON Europa 2019 will have the opportunity to present themselves in an impressive way at a forum that is unique in the world.