Winners 2019

And the winner is…

Review: The winners of the 3rd productronica innovation award were announced on the first day of productronica 2019: after a thorough evaluation, the top-class, independent jury selected the winners in each of the 6 clusters from 80 submissions.

With the AM 04 Duomatic, Zoller + Fröhlich now closes the gap between fully automated and manual cable assembly. In summary, the AM 04 Duomatic with its universal, semi-automated and globally unique mode of operation describes the new standard for time-, cost- and quality-optimized stripping and crimping in cable assembly. Small and medium-sized companies are offered the opportunity to optimize their production without the need for a high investment.

The BAMFIT-Tester (Bond Accelerated Mechanical Fatigue Interconnect Test) is a disruptive new development for extremely accelerated, fully automated lifetime tests on thick-wire bonds in power semiconductors. It extends classical power cycling by an automated rapid test that runs within a few minutes. This makes reliability and lifetime tests possible during development and production. BAMFIT was realized on the basis of an automatic wire bonder and is patent pending.

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"DRV-Z1 | Digital Stereo 3D Full HD Viewing System with Zoom. The DRV-Z1 is the world's first patented digital stereo 3D viewing system, with exceptional hand-eye coordination necessary for natural working. The combination of a perfect three-dimensional image, with detailed high-resolution viewing and an extra-large field of view, creates a completely new visualization experience and results in the best possible comfortable inspection and manipulation."

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The LUVIR Technology is a unique combination of both UV-Laser & IR-Laser Power where the IR serves to heat up the ink directly before the UV-Laser starts the polymerization. The heat makes the ink more reactive for the polymerization process, which significantly reduces the UV-Power needed for the complete polymerization of the ink, thus greatly increasing the overall throughput of the LDI.

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CoS is a new development of ASM AMICRA especially designed to conquer all Chip on Submount applications. This machine is capable to perform multi-die bonding of up to +/- 3µm@3s placement accuracy on singulated submounts by using eutectic bonding method, realized either with a ceramic pulse heater or localized non-contact laser heating with a cycle time up to 6s. Beside this bonding methods the CoS can also be equipped with epoxy stamping suitable for solder paste or epoxy. The core is the bonding table equipped with two bonding chucks. 

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"The new SelectLine-C has been designed for the constantly growing requirements in the manufacturing of next-generation products. The system provides an automatic software switch to change from a conventional production mode, where the assembly stops at each station (micro drop jet fluxer, preheat station, electromagnetic soldering unit, selective brushing unit, AOI) for the duration of the process step, to a continuous mode. This new process is able to handle products of any length. Even reel-to-reel applications are supported. "

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With productronica 2021, we will continue our success story. Who will hold the trophy in their hands in 2021?