productronica Innovation Award 2025
The productronica Innovation Award 2025 challenged the innovative power of the electronics manufacturing industry for the sixth time! The prestigious award was presented on the first day of productronica 2025 in cooperation with trade fair organizer Messe München and the trade journal productronic. The award recognized the most innovative new products and manufacturing processes in six categories. Since 2023, the runners-up and third-place winners have also been honored. The next presentation of the productronica Innovation Award will take place in 2027.
In which categories is the award presented?
From November 18 to 21, 2025, it was that time again! The world's leading trade fair, productronica, reflected the entire spectrum of innovative electronics manufacturing. The award addresses the segmentation of the trade fair and thus also the hall layout: The six categories for the productronica Innovation Award have proven their worth and were once again featured this year. The most innovative new products and manufacturing processes were honored. The clusters in detail are:
PCB & EMS Cluster
Printed circuit board and circuit carrier manufacturing, electronic manufacturing services (EMS).
SMT Cluster
Assembly, soldering technology, product finishing, production subsystems, production logistics, and material flow technology
Inspection & Quality Cluster
Measurement and testing technology, quality assurance, and inspection solutions
Semiconductor Cluster
Semiconductor manufacturing, display manufacturing, LEDs and discrete components, photovoltaic manufacturing, micro-nano production, clean room technology, materials processing
Cables, Coils & Hybrids Cluster
Manufacturing technologies for cables and connectors, winding goods and hybrid component manufacturing
Future Markets Cluster
IT to production, Industry 4.0, digitalization, manufacturing of batteries and electrical energy storage devices, organic and printed electronics, 3D printing, additive manufacturing
The jury
An independent jury of industry experts will award prizes in six categories for the most innovative new products and manufacturing processes. The jury is composed of the following individuals:
- SMT cluster: Dr. Maik Hampicke, Head of Department Marketing & Business Development, Fraunhofer Institute for Reliability and Microintegration IZM
- Cluster PCB & EMS: Dr. Andrej Novikov, Institute for Device Systems and Circuit Technology, University of Rostock IEF/IGS
- Cluster Inspection & Quality: Helge Schimanski, Group Manager, Fraunhofer Institute for Silicon Technology ISIT
- Cluster Semiconductor: Dr. Udo Gommel, Fraunhofer Institute for Manufacturing Engineering and Automation IPA
- Future Markets Cluster: Dr. Sandra Engle, Productronic Department, VDMA Electronics, Micro and New Energy Production Technologies
- Cable, Coils & Hybrids Cluster: Sebastian Glatz, ZVEI Managing Director, Cable and Insulated Wires Association in Cologne
Registration closed
Online registration for the productronica Innovation Award 2025 is now closed!
We look forward to welcoming you again in 2027.
Conditions of participation
- Only exhibitors at productronica 2025 are eligible to apply for the productronica Innovation Award. All exhibiting companies are invited to apply.
- Only innovations/new products or innovative manufacturing processes that are presented at the productronica 2025 exhibition stands and are no more than 12 months old at that time are eligible for an award. The product must be exhibited at the trade fair booth and be ready for demonstration!
- Development projects will only be considered in the Future Markets Cluster.
- The innovations/new products must already be available for purchase at the time of presentation. (Exception: Future Markets Cluster)
- Each exhibitor may submit several innovations/new products to the competition.
The winners of the 6th productronica innovation award 2025 are:
Review: On the first day of productronica 2025, the winners of the 6th productronica innovation award were announced: After thorough evaluation, the high-caliber, independent jury selected the respective winners in the six clusters from nearly 80 submissions.
Winner in the Cables, Coils & Hybrids cluster: Komax
Blade axis regulation system
Adaptive Incision Control (AIC) is a blade axis regulation system for automatic and semiautomatic crimping machines used in wire processing. It continuously measures capacitive values during insulation stripping and adjusts blade movements to avoid strand contact, ensuring high-quality results. AIC automatically compensates for wire diameter tolerances with-out operator input, improving efficiency, reducing scrap, and simplifying operation. This technology also powers the new “tech-mode” in semi-automatic machines, which autonomously analyzes cable samples and sets processing parameters – eliminating manual programming and enhancing speed and consistency.
The second prize winner is Cellios with its intRAC (Intelligent Robotic Assembly Cell), a fully automated system for manufacturing complex cable harnesses. Third place went to Zoller & Fröhlich with its AM UP6e, an electro-pneumatic stripper-crimper.
Winner in the Future Markets cluster: Xplain Data
Causal AI for production
Xplain Data is revolutionizing electronics production with causal AI: The patented Causal Discoverer YieldPro object analytics database combines design, process, and test data to provide a 360° view of the manufactured part. Based on this, causal AI algorithms automatically identify the causes of errors without manual data preparation or feature engineering. This end-to-end transparency enables preventive quality assurance and continuous process optimization.
Dr. Michael Haft, CEO of Xplain Data: "This award is a great endorsement for our team and the trust our customers place in us. CausalDiscoverer YieldPro shows how AI should be in manufacturing: explainable and actionable. The award spurs us on to further innovation: to holistically analyze and specifically optimize even the most complex production processes with causal AI."
Second place went to Seho Systems for its process-integrated inspection of flux application. Third place went to Juki Automation Systems with its multifunctional JM-E01 automatic placement machine.
Winner in the Inspection & Quality cluster: Palitronica
Palitronica: Anvil – Inspection & Quality Palitronica
Anvil leverages RF echo reflectometry for quality assurance and supply chain cybersecurity, adapting a physical sciences method to uncover defects and fraud in electronics. The innovation in the last 12 months was to productize the technique from the lab and get a product on the market. First product to detect hidden issues like HBOM violations in real time, enabling end-of-line analysis of encapsulated products, secure COTS integration, and positive control.
Florian Fischmeister, CEO and co-founder of Palitronica: "We are honored to take first place in the ‘Cluster Inspection & Quality’ category. This award reflects our commitment to pushing the boundaries of hardware cybersecurity and manufacturing integrity. We look forward to continuing this momentum as we help ensure that you can trust every electronic component you buy or manufacture.
Koh Young Europe took second place with KPO, an AI-powered optimization platform. The third prize winner is Mirtec with Genesys-CC, an optical system that can detect bubbles up to 30 μm in size.
Winner in the PCB & EMS cluster: Schmid Group
Chemical Mechanical Planarization
Chemical mechanical planarization enables flatness and uniformity in rectangular substrates and printed circuit boards up to 24.5“ x 24.5” in size. It is suitable for advanced assembly technologies for panel-level packaging and SLP, including “Any Layer ET-Board,” SAP, and TGV-Level as glass substrates. The technology will be indispensable in mass production for structures below 5 µm. Depending on the application, a wide range of slurry chemicals can be used to meet specific product requirements.
Christian Schmid, CEO Schmid Group: "With the InfinityLine L+, SCHMID Group has developed a CMP solution that enables the precision we know from semiconductor manufacturing on large-format substrates. With the InfinityLine L+, we are setting new standards in terms of planarity, process stability, and automation. This key technology is an important step for future advanced packaging solutions and demonstrates how consistency, engineering, and team spirit at the SCHMID Group enable groundbreaking innovations.
Second place went to Schmoll Maschinen with the Pico Combi, a laser microvia drilling and structuring machine. Notion Systems took third place with the n.jet soldermask multi-color inkjet printing system.
Winner in the Semiconductor cluster: AP&S International
Box cleaning
The "CleanSurF automated" is the leader in box cleaning. It was developed for maximum efficiency, seamless factory integration, and uncompromising cleanliness. Its robot-based architecture enables high throughput and flexible configurations that are perfectly tailored to the requirements of modern, automated factories. Despite its powerful performance, the CleanSurF impresses with its small footprint and smooth integration into OHT-based transport systems. Camera-monitored robotics ensure absolute process reliability, while optional features such as N₂ purging, ionization, or gripper cleaning offer additional safety and flexibility. The CleanSurF automated is the future-proof solution for cleaning 8-inch SMIF and 12-inch FOUP to the highest standards.
Tobias Bausch, CMO & CTO AP&S International: “We are proud and honored that our box cleaner ”CleanSurF automated" has been awarded the productronica Innovation Award 2025 in the Semiconductor cluster. This recognition once again confirms our claim to set new standards in semiconductor manufacturing with the highest precision, automation, and process reliability. My thanks go to our entire team—together we are shaping the future of wet process technology."
Second place went to F&S Bondtec Semiconductor with a 3D wire bonder. The third-place finisher withdrew its application shortly before the award ceremony and wishes to remain anonymous.
Winner in the SMT cluster: Ersa
Batch machine for press-fit technology
Versafit One – the semi-automatic batch machine for press-fit technology offers maximum precision and 100% process reliability with a compact footprint and attractive price. Press-fitting without thermal stress and without flux delivers minimal contact resistance and highly resilient connections for high-power applications. The Versafit One offers short cycle times, fast manual tool changes, and is operator-independent – ideal for medium-sized businesses.
Rainer Krauss, Head of Sales at Ersa: "We are proud and delighted to receive the productronica Innovation Award for the Versafit One. The Versafit One is a semi-automatic press-fit machine that meets the needs of EMS and in-house manufacturers. It is Ersa's entry into press-fit technology for the production of flat assemblies for high-performance electronics, which are then used, for example, in electromobility or in the generation of green electricity."
Grif-Tools Ltd. took second place with the MPG, a programmable gripper for robots that grips using vacuum. The third prize winner is IO Tech – Reophotonics Ltd. The EU-funded io600 brings CLAD technology to in-line mass production.
The productronica Innovation Award 2025 in cooperation with the trade journal productronic