4. productronica innovation award: And the Winner is…

Flexmedia is a family of extremely compact instrumentation modules powered and connected via PoE (Power over Ethernet), that can be used to build flexible, scalable customized functional testers for production testing. This lowers the overall cost of the test. The new modules are ideally-suited for test applications in the automotive industry, including infotainment, audio & video and battery management. Their compact size makes it easier to place them closer to the DUT, thus guaranteeing signal integrity, and ensuring higher performance.
➤ Halle A1, Stand 439
(Bild: Alfamation)

1 / 6

The requirements of highest cleanliness, maximum production yield and best possible utilization of valuable and limited cleanroom space in semiconductor manufacturing require fast, reliable, compact and flexible cleaning systems for wafer transport and storage devices such as FOUPs and SMIFs. With the new CleanSurf system, the cleaning of a wide variety of common wafer transport and stock containers (SMIFs, FOUPs, carriers, boxes) is possible in one tool. Efficient cleaning is achieved, furthermore the water and nitrogen consumption of the system is very low. The concept is designed for both manual and automatic loading. A practical gate function between gray and cleanroom is possible with the tool. The nozzle concept as well as the rotary carousel have been completely redeveloped.
➤ Halle B1, Stand 221
(Bild: AP&S International)

2 / 6

IoTech has developed a disruptive multi-material additive manufacturing technology. It can process almost any industry certified material at high resolution and high speed.Manufacturers can use their standard industry materials, control the deposition of each single drop and reach unmatched production yields. Whether PCB HDI, solder mask, legend printing, solder paste deposition or semiconductor packaging, IoTech’s technology enables the production of currently unachievable designs and creates an eco-friendly alternative to many traditional manufacturing methods.
➤ Halle B2, Stand 217
(Bild: IO Tech)

3 / 6

The S70 is a modular platform for processing coaxial and multi-conductor cables, which are primarily used in the automotive industry in the high-voltage and e-mobility sectors. The modular design allows extremely high flexibility in the configuration of the platform. It can be expanded on site - on the customer‘s factory floor. New base modules and stations can be easily integrated. This allows users to customize the platform and gradually increase the level of automation. Previously laborious manual processes are automated with the S70 and achieve repeatable and highly precise quality. This means maximum process reliability and the reliable fulfillment of high industry standards.
➤ Halle B4, Stand 305
(Bild: Schleuniger)

4 / 6

Die langen Umstellzeiten beim Wechsel von Lötprofilen führen zu einer geringeren Maschinenverfügbarkeit durch hohe Stillstandszeiten. Während der Stillstandszeiten kann nicht produziert werden, was die Deckung der Linienkosten vermindert. Die Parametrisierung von Luftstrom mit stufenlos regelbaren Lüftereinheiten und einem innovativen Heizzonen-Konzept ermöglicht ein prozessoptimiertes Lötprofil, das bei gleichbleibenden Temperatureinstellungen flexibel auf die unterschiedlichen Kundenprodukte angewendet wird.Dies soll dem Kunden eine Eliminierung der Umstellzeiten zwischen unterschiedlichen Lötprofilen ermöglichen, damit die Anlagenverfügbarkeit maximieren und schließlich Kosten sparen.
➤ Halle A4, Stand 155
(Bild: SMT Wertheim)

5 / 6

Koh Young creates the industry’s first 3D in-line DPI and thickness measurement solution for transparent material inspection. The system allows manufacturers to explore the depths of its process and to accurately identify defects with 2D, 3D, and cross-section views. The system also accurately measures materials for coverage, thickness, and consistency with user defined threshold settings. It also inspects bubbles and other defects as small as 200-microns, even inspecting „keep out“ areas for 100-micron splash marks. The goal is to monitor and control the quality of the coating process and giving feedback to optimize the coating process.
➤ Halle A2, Stand 377
(Bild: Koh Young)

6 / 6