Das sind die Bewerber im Cluster Inspection & Quality

Acculogic GmbH: Scorpion Flying Bridge
All tests in one station with the 64 probes flying bridge system. Can you imagine performing every potential test in one Flying Prober test system? It’s the wish of every test engineer to be able to connect all types of instrumentation automatically to the Unit Under Test (UUT) then perform all types of test and inspection techniques. In one system, Acculogic’s new Flying Bridge option makes that a reality, connecting 64 channels to 64 probes.

(Quelle: Acculogic GmbH)

Alfamation SpA: Flexmedia XM
Flexmedia XM is a family of extremely compact instrumentation modules powered and connected via PoE (Power over Ethernet), that can be used to build flexible, scalable customized functional testers for production testing, lowering the total cost of test. The new modules are ideally-suited for test applications in the automotive industry, including infotainment, audio & video and battery management. Their compact size makes it easier to place them closer to the DUT, thus guaranteeing signal integrity, and ensuring higher performance.

(Quelle: Alfamation SpA)

GÖPEL electronic GmbH: fleX Line 3D
Flexmedia XM is a family of extremely compact instrumentation modules powered and connected via PoE (Power over Ethernet), that can be used to build flexible, scalable customized functional testers for production testing, lowering the total cost of test. The new modules are ideally-suited for test applications in the automotive industry, including infotainment, audio & video and battery management. Their compact size makes it easier to place them closer to the DUT, thus guaranteeing signal integrity, and ensuring higher performance.

(Quelle: GÖPEL electronic GmbH)

iTAC Software AG: Quality Management
Quality Management beinhaltet optimierte Analyse- und Reporting-Funktionen für alle produktrelevanten Qualitätsdaten. Daten können direkt im Produktionsprozess ausgewertet werden und spiegeln so die aktuelle Qualität wider. Das QM-Modul unterstützt unter anderem verschiedene Arten der Analyse wie Ressourcenanalyse, Produktanalyse sowie Fehler- und Fehlerartenanalyse. Zudem lassen sich die konsolidierten Daten an übergeordnete Qualitätssysteme zur weiteren Verarbeitung und Analyse weiterleiten.

(Quelle: iTAC Software AG)

KIC: WPI
FC CREATIVITY AND INNOVATION: The Wave Process Inspection System (WPI) is the latest in KIC’s innovative line of solutions for thermal processes in electronics manufacturing. It brings process monitoring, process control, and traceability to wave soldering. KIC is well-known as the market and technology leader in solutions for reflow soldering, curing, and other thermal processes and has the most robust and flexible capabilities when addressing manufacturing requirements. The WPI brings KIC’s award-winning technology and thermal experience to the wave solder process.Innovation with industry firsts (patent pending) for sensor technology and novel proprietarymethods for output of a complete temperature profile including Dwell Time and Parallelismmeasurement for each production board. WPI Includes: Recipe Optimization software, Process Window Index (PWI), Interface with barcode scanning or MES output of board ID, Connectivity – with factory systems and MES software, SMEMA interface for process control and reduced defects, Audible/visual notifications of process conditions, Automated real-time production temperature profile and wave dataFC COST EFFECTIVENESS: WPI is designed to give maximum value and fast payback bystreamlining your wave soldering process management. Reduce engineering and technician hours spent on wave solder machine setup and monitoring through automation. Automated profile and wave KPI data collection during production, increasing OEE. Defect reduction through real-time analytics and SPC to prevent assemblies from entering a suspect process. Increased data collection streamlines Continuous Improvement tasks. Automated traceability data connectivity to MES to meet customer requirements. FC ENVIRONMENTAL FRIENDLINESS: Through the overall improved management of the wavesolder process utilizing WPI, electronic manufacturers can fine tune the wave process setup,thereby maintaining the optimum fluxing, preheating, and soldering configurations. This willreduce waste of materials and reduce power consumption through optimization andcontinuous monitoring.FC QUALITY CONTRIBUTION: With inline Wave Process Inspection, manufacturing with through-hole technologies now has the similar capabilities as SMT inspection achieves with SPI and AOI. This gives all the benefit of ensuring every board processed is meeting the requirements resulting in quality solder joints. Process variations are flagged, and boards prevented from entering the wave solder machine when control is drifting. Investment in WPI is a step toward total process control and quality management.FC EASE OF USE: Setup and programming for production is a simple step-by-step guided procedure, only done for the initial production run. Following production runs for the same board require a simple one-step mouse click to begin. Depending on configurations changeover can also be automated to reduce changeover time and reduce potential for operator error.FC EXPECTED MAINTAINABILITY/REPAIRABILITY: Troubleshooting tools in the software provideinsight into the root cause of process issues and track the status of the WPI system sensors and hardware with visual and audible notifications. Maintenance of the system is easily integrated into the wave solder machine maintenance. Spare parts are readily available when needed.

(Quelle: KIC)

LXinstruments GmbH: LX-TSM
Entwicklung eines neuen Testsequenzers, der modern und preisgünstig ist, dabei aber übersichtlich und vor allem intuitiv bedienbar. Er verfügt über alle wichtigen Standardfunktionen, bleibt dennoch transparent dank des reduzierten Funktionsumfangs. Besonders geeignet für klassische Funktionstestanwendungen bei begrenztem Budget.

(Quelle: LXinstruments GmbH)

Mirtec GmbH: MIRTEC GENESYS-PIN
Die Mirtec GENESYS-PIN ist ein Pin-Inspektionssystem für Automobilprodukte. Es verfügt über eine 12 Megapixel Kamera, 9-Phasen-RGB-Farbbeleuchtung, einer langen Hub-Z-Achse und vier programmierbare Digital-Projektoren, welche eine Hybrid-3D-Messtechnik ergeben. Dank dieser Technik können Pins (Anschlussstifte) bis 50 mm Höhe auf Fehlen, Versatz, Abstand und vielen weiteren Fehlern geprüft werden. Was bis jetzt mit konventionellen 3D AOI nicht möglich war.

(Quelle: Mirtec GmbH)

Omron Europe B.V.: VT-S1080
In 1987 Omron introduced the world's first color AOI system. It incorporated Omron’s Patent Color Highlight Illumination providing high quality solder joint inspection. As PCBA designs become denser, companies are increasingly facing greater challenges to provide high-quality zero-defect manufacturing. Today Omron launches another world’s first innovation technology in Illumination called Multi Color, Multi Directional (MDMC), with Omron Patent Multi Phase Shift (MPS) Projectors.

(Quelle: Omron Europe B.V.)

PARMI Europe GmbH: Autoteachen
Autoteachfunktionen mit KI-Algorithmen übernehmen das Teachen von Bauteilen beim AOI

(Quelle: PARMI Europe GmbH)

ProMik GmbH: SMART ICT
SMART ICT ist ein „Inside-Out-Approach” zum klassichen In-Circuit Test. Durch den Einsatz eines SMART ICT Bootloader der auf den Haupt MCU der Zielapplikation läuft, können Komponenten und Module auf Funktionalität und richtiger Bestückung getestet werden, ohne die Notwendigkeit von physischen Verbindung über Testpunkte. Die Technologie vereint Vorgehensweisen des klassischen In-Cicuit Tests mit funktionalen Testkonzepten.

(Quelle: ProMik GmbH)

QualityLine: Advanced Analytics
The development of a data integration system that combines Artificial Intelligence and Machine Learning technology will automatically analyse all captured data using advanced algorithms and create an interactive manufacturing analytics dashboard that includes automatic anomaly detection and alerts.

(Quelle: QualityLine)

Viscom AG: iX7059 Heavy Duty Inspection
Die iX7059 Heavy Duty Inspection ermöglicht die schnelle und hochpräzise 3D-Inline-Röntgenprüfung massiver Baugruppen. Ein innovatives dynamisches Bildaufnahmekonzept macht die Volumen- und Schichtberechnung mit planarer CT noch taktzeitkompatibler als bisher. Die zu prüfenden Objekte können bis zu 500 mm x 500 mm groß, bis zu 40 kg schwer und bereits eingehaust sein. Das reibungslose Handling übernimmt ein spezielles Transportsystem.

(Quelle: Viscom AG)