Das sind die Bewerber im Cluster Semiconductor

AP&S International GmbH: CleanSurF®
The cleanliness of the environment as well as the production equipment is a key factor for successful semiconductor manufacturing. Particles of various origins must be avoided throughout the entire semiconductor manufacturing process, including during wafer storage and transport between the individual bays (different areas of the fabs). Transport enclosures such as FOUP and SMIF protect the wafers from damage and contamination. Within these, the particle density is very low, so these transport boxes can be considered as essential ""mini cleanrooms"" within the cleanrooms, leading to higher production yields when used correctly. The new AP&S CleanSurF® cleaner ensures the cleanliness of all these standardized wafer transport containers like FOUPs, SMIFs, carriers and boxes in accordance with highest purity standards to secure the process chains in semiconductor manufacturing and ensure maximum productivity. High throughput, optimum cleaning performance, maximum flexibility in use and attractive operating costs are the advantages of the new cleaning machine. The special feature of the CleanSurF® product concept is that the cleaner is designed for both manual and automatic loading. It can also be connected to a FOUP stacker for cleaning during intermediate storage of the containers. Two newly developed components contribute decisively to the efficient particle and AMC (airborne molecular contamination) cleaning performance as well as to shorter process times:1. An innovative nozzle concept enables flexible, 360-degree, separately controllable handlingof the nozzles. More than 50 nozzles (DIW and N2 nozzles) are installed in the tool, ensuringperfect cleaning results. In addition, the separate controllability of the nozzles enables aconsiderable reduction in water consumption, since only those nozzles are used which arerequired for the respective cleaning cycle.2. A new carousel design with flexible equipment holders allows cleaning of very differentwafer transport containers in one machine. Additional interlocks with safety features formanual loading ensure that the operator can load the equipment conveniently and quickly.With its very compact footprint of approximately 3 m², the CleanSurF® offers a high loadingcapacity of up to 12 x 12 inch FOUPs per run.A second process chamber door provides a practical gate function for a gray room-clean roomseparation, which means that the FOUPs to be cleaned can be loaded in the gray room andremoved in the cleaned state in the clean room. The new SECS interface ensures maximum data transparency and comprehensive information regarding the cleaned FOUPs. The latest software technology including HMI according to SemiII standard, guarantees maximum process reliability. User-friendly monitoring ensures convenient and simple system handling. This includes: schematic display of the process chamber, of process values and active spray elements, as well as simple recipe management and a wide range of export functions.

(Quelle: AP&S)

budatec GmbH: SP300 Sinterpresse 300KN
Die neuartige Sinterpresse ist für die neue Sintertechnologie von hochfesten Fügen von Leistungshalbleitern auf unedlen Oberflächen wie Kupfer oder Aluminium. Dabei wird eine Wärmeleitfähigkeit von über 200W/mK bei höchster Zuverlässigkeit gewährleistet. Der Sinterprozess erfolgt unter definierten Atmosphären wie Stickstoff oder Wasserstoff.

(Quelle: budatec GmbH)

Data I/O: SentriX Product Creator
The next generation SentriX Security Deployment Platform simplifies end-to-end the provisioning and deployment of robust hardware-based security for IoT and automotive applications and enables an outsourced as-a-Service business model. The next generation SentriX is comprised of an updated automated security provisioning system with a new integrated FIPS 140-2 compliant hardware security module and the new SentriX Product Creator software tool. SentriX Product Creator is a powerful software suite that enables OEMs, silicon vendors and programming facilities to define and collaborate on security definitions. SentriX Product Creator supports two deployment models in cooperation with leading embedded silicon vendors: SentriX GOTM and SentriX Custom. SentriX GO streamlines IoT security deployment and provisioning using pre-configured use cases and a simplified developer experience. SentriX GO supports the most common use cases for creating and managing device identities, secure boot, cloud onboarding, device authentication and others.SentriX Custom supports fully custom provisioning definitions. Both models enable product security definition collaboration between OEM, silicon vendors and programming partners to easily define, provision and deploy robust IoT device security using Data I/O’s SentriX security deployment platform.

(Quelle: Data I/O)

Festo SE & Co KG: VTEP
VTEP ist ein mehrkanaliges Piezoventilsystem zur Regelung von Druck und Gasströmen. Durch höchste Systemintegration mit EtherCAT können auf kleinstem Bauraum 10 Gasströme mit minimalem Aufwand unabhängig voneinander geregelt werden. Manuelle Gasprozesse werden digitalisiert, dadurch transparent und flexibel. Die Gasverwendung wird bedarfsgerecht auf das Minimum reduziert, Ressourcen damit geschont. Die hohe Systemintegration erlaubt verglichen zu Analogtechnik wettbewerbsfähige Einstiegspreise.

(Quelle: Festo SE & CoKG)

F&S BONDTEC Semiconductor GmbH: Universal-Fertigungszelle 86XX
Unsere Universal-Fertigungszelle 86XX erlaubt nicht nur die Fertigung, sondern auch das Re-Manufacturing von Batteriemodulen aus zylindrischen Zellen, indem sie Drahtbonds aufbringt und sie zur Wiederaufarbeitung der Module wieder entfernt, sodass die Zellen nach Sortierung wieder zu neuen Modulen zusammengebaut werden können.

(Quelle: F&S BONDTEC)